MIL-PRF-19500/562E
4.3.1 Screening (JANHC and JANKC). Screening of die shall be in accordance with MIL-PRF-19500. As a
minimum, die shall be 100-percent probed in accordance with table I, subgroup 2.
4.3.2 Gate stress test. Apply VGS = ±30 V minimum for t = 250 µs minimum.
* 4.3.3 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3161 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
Measurement delay time (tMD) = 70 µs max. See table II, group E, subgroup 4 herein.
4.3.4 Unclamped inductive switching.
a. Peak current (ID) ............................................. Rated ID1.
b. Peak gate voltage (VGS).................................. -10 V.
c. Gate to source resistor (RGS) .......................... 25 Ω ≤ RGS ≤ 200 Ω.
d. Initial case temperature (TC) ........................... +25°C +10°C, -5°C.
e. Inductance (L)................................................. 100 µH ±10 percent.
f. Number of pulses to be applied ....................... 1 pulse minimum.
g. Pulse repetition rate........................................ None.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500. Alternate flow
is allowed for quality conformance inspection in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I
herein. Electrical measurements (end-points) shall be in accordance with subgroup 2 of table I herein
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIA (JANS) and table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and herein.
Electrical measurements (end-points) shall be in accordance with subgroup 2 of table I herein.
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