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MIL-PRF-19500-599 Semiconductor Device, Transistors, Quad, Field Effect, P-Channel, Silicon, Type 2N7335, Jan, Jantx, Jantxv, Jans, Janhc, And JankcThis specification covers the performance requirements for quad P-channel, enhancement-mode, MOSFET, power transistor with avalanche energy ratings \(EAS and EAR\) and maximum avalanche current \(IAR\). Four levels of product assurance are provided for each encapsulated device type as specified in MIL?√PRF?√19500. Two levels of product assurance for each unencapsulated device type die \(element evaluation\) as specified in MIL?√PRF?√19500.

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MIL­PRF­19500/599E
4.4.4 Group E inspection (except JANHC and JANKC). Group E inspection shall be conducted in accordance with
the conditions specified for subgroup testing in table E­IX of MIL­PRF­19500 and as specified in table II herein.
Electrical measurements (end-points) shall be in accordance with table I, subgroup 2 herein. Delta requirements shall
be in accordance with the applicable steps of table II herein.
4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse response measurements. The conditions for pulse response measurement shall be as specified in
section 4 of MIL­STD­750.
4.5.2 Thermal resistance. Thermal resistance measurements shall be performed in accordance with method 3161
of MIL­STD­750. RθJA1 maximum = 90°C/W, for each die.
a.
IM measuring current
10 mA.
IH drain heating current
0.15 A minimum.
b.
Steady-state (see method 3161 of MIL­STD­750 for definition).
tH heating time
c.
VH drain-source heating voltage
15 V minimum.
d.
30 to 60 µs.
tMD measurement time delay
e.
10 µs maximum.
tSW sample window time
f.
10



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