MIL-PRF-19500/611A
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.3).
3.1 Associated detail specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified
herein.
3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in
MIL-PRF-19500.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified on figure
1 herein. Methods used for electrical isolation of the terminal feedthroughs shall employ materials that contain a minimum of 90 percent
AL2O3 (ceramic). Examples of such construction techniques are metallized ceramic eyelets or ceramic walled packages. The US
government's preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-
pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take
precedence.
3.3.1 Lead formation and finish. Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein. Where a
choice of lead finish or formation is desired, it shall be specified in the acquisition requirements (see 6.2). When lead formation is
performed, as a minimum, the vendor shall perform 100 percent hermetic seal in accordance with screen 14, of MIL-PRF-19500.
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500.
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