MIL-PRF-19500-117 Semiconductor Devices, Diode, Silicon, Voltage Regulator, Types 1N962B- 1 Through 1N992B-1, And 1N962Bur-1 Through 1N992Bur-1, 1N962C-1 Through 1N992C-1, And 1N962Cur-1 Through 1N992Cur-1, And 1N962D-1 Through 1N992D-1, 1N962Dur-1 Through 1N992Dur-1, Jan, Jantx, Jantxv, Janhc And JankcThis specification covers the performance requirements for 500 milliwatt, silicon, voltage regulator diodes with voltage tolerances of 5 percent, 2 percent, and 1 percent. Three levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. One level of product assurance is provided for each unencapsulated device type.

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MIL-PRF-19500/117R

1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in maximum and primary

test ratings (see 3.8) herein and as follows:

a. 11 V dc ≤ VZ ≤ 200 V dc.

b. 1N962B-1 through 1N992B-1 are 5 percent voltage tolerance.

c. 1N962C-1 through 1N992C-1 are 2 percent voltage tolerance.

d. 1N962D-1 through 1N992D-1 are 1 percent voltage tolerance.

Thermal resistance:

RΘJL = 250�C/W maximum at L = .375 inch (9.53 mm) (DO-35).

RΘJEC = 100�C/W maximum. Junction to end-caps (DO-213AA).

RΘJA(PCB) = 300�C/W junction to ambient including PCB see note (1).

(1) See figures 4, 5, and 6 for derating curves. TA = +75�C for both axial and MELF (Metal Electrical

Leadless Face) (US) on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-Oz Cu,

horizontal, still air, pads (US) = .067 inch (1.70 mm) x .105 inch (2.67 mm); pads (axial) = .092 inch

(2.34 mm) diameter, strip = .030 inch (0.762 mm) x 1 inch (25.4 mm) long, axial lead length L ≤ .187

inch (≤ 4.76 mm); RΘJA(PCB) with a defined thermal resistance condition included is measured at IZ =

as defined in the electrical characteristics tolerance table herein.

(2) For thermal impedance curves see figures 7, 8, and 9.

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This

section does not include documents cited in other sections of this specification or recommended for additional

information or as examples. While every effort has been made to ensure the completeness of this list, document

users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this

specification, whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a

part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are

those cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-19500

Semiconductor Devices, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-750

Test Methods for Semiconductor Devices.

(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or

https://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,

Philadelphia, PA 19111-5094.)

2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited

herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws

and regulations unless a specific exemption has been obtained.