MIL-PRF-19500/117R
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined
in MIL-PRF-19500, and as follows.
EC - - - - - - - - end-caps.
RΘJA(PCB) - - - thermal resistance junction to ambient, with a defined printed circuit board mounting.
RΘJBB - - - - - - Thermal resistance junction to burn-in board.
3.4 Interface and physical dimensions. The interface and physical dimensions shall be specified in
MIL-PRF-19500 and figures 1 and 2 (similar to DO-35 and DO-213AA), and figure 3 (die) herein.
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.4.2 Diode construction. All devices shall be metallurgically bonded double plug construction in accordance with
the requirements of category I, II, or III (see MIL-PRF-19500).
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500. Manufacturer's identification and date code
shall be marked on the devices. Initial container package marking shall be in accordance with MIL-PRF-19500. The
polarity shall be indicated with a contrasting color band to denote the cathode end. The prefixes JAN, JANTX, and
JANTXV can be abbreviated as J, JX, and JV, respectively. (example: The part number can be reduced to J962B1)
No color coding shall be permitted for part numbering.
3.5.1 Marking of UR devices. For `UR' version devices only, all marking, except polarity may be omitted from the
body, but shall be retained on the initial container. Polarity marking of `UR' devices shall consist as a minimum, a
band or 3 contrasting dots around the periphery of the cathode.
3.6 Selection of tight tolerance devices. The C and D suffix devices shall be selected from JAN, JANTX, or
JANTXV devices, which have successfully completed all applicable screening, and groups A, B, and C testing as 5
percent tolerance devices. All sublots of C and D suffix devices shall pass table I, subgroup 2, at tightened
tolerances. Tighter tolerances for mounting clip temperature shall be maintained for reference purpose to establish
correlation. For C and D tolerance levels, TL = +25°C ±2°C at .375 inch (9.53 mm) from body or equivalent.
3.7 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I, II, and III.
3.8 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I
herein.
3.9 Maximum and primary test ratings. Maximum and primary test ratings for voltage regulator diodes are
specified in table IV herein.
3.10 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
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