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MIL-PRF-19500-117 Semiconductor Devices, Diode, Silicon, Voltage Regulator, Types 1N962B- 1 Through 1N992B-1, And 1N962Bur-1 Through 1N992Bur-1, 1N962C-1 Through 1N992C-1, And 1N962Cur-1 Through 1N992Cur-1, And 1N962D-1 Through 1N992D-1, 1N962Dur-1 Through 1N992Dur-1, Jan, Jantx, Jantxv, Janhc And JankcThis specification covers the performance requirements for 500 milliwatt, silicon, voltage regulator diodes with voltage tolerances of 5 percent, 2 percent, and 1 percent. Three levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. One level of product assurance is provided for each unencapsulated device type.

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MIL-PRF-19500/117R
4.3.1 Screening (JANHC). Screening of JANHC die shall be in accordance with appendix G of MIL-PRF-19500.
4.3.1.1 JAN testing. JAN level product will have temperature cycling and thermal impedance testing performed in
accordance with MIL-PRF-19500, JANTX level screening level requirements.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with
method 3101 or 4081, as applicable, of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH,
tMD (and VC where appropriate). Measurement delay time tMD = 70 μs max. (See table II, subgroup 4). See figure
10 for mounting conditions.
4.3.3 Power burn-in conditions. Power burn-in conditions are as follows: Izm (min) = column 8 of table IV; TA =
75°C maximum. Test conditions in accordance with method 1038 of MIL-STD-750, condition B (see 4.5.6). Adjust
IZ or TA to achieve the required TJ. TJ = 125°C minimum. With approval of the qualifying activity and preparing
activity, alternate burn-in criteria (hours, bias conditions, TJ mounting conditions) may be used for JANTX and
JANTXV quality levels. A justification demonstrating equivalence is required. In addition, the manufacturing site's
burn-in data and performance history will be essential criteria for burn-in modification approval.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein. Group A inspection shall be performed on each sublot.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table E-VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and 4.4.2.1 herein.
Electrical measurements (end-points) shall be in accordance with the applicable inspections of table III herein.
4.4.2.1 Group B inspection, appendix E, table E-VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500.
Subgroup
Method
Condition
0°C to +100°C, 10 cycles.
B2
1056
-55°C to +175°C, 25 cycles.
B2
1051
B2
4066
See 4.5.1.
IZ(min) = column 8 of table IV. Adjust IZ or TA to achieve TJ = 150°C minimum
B3
1027
(see 4.5.6).
B4
2101
Decap analysis, scribe and break only.
8



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