MIL-PRF-19500/159P
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: IZ = 7.5 mA dc, 0.75 mA dc,
TA = +150C, +5C, -0C.
4.3.2 Screening (JANHC and JANKC). Screening of JANHC and JANKC die shall be in accordance with
MIL-PRF-19500.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E-V of MIL-PRF-19500
and table I herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIa (JANS) and table E-VIb (JAN, JANTX, JANTXV, ) of MIL-PRF-19500. Electrical
measurements (end-points) shall be in accordance with the applicable steps of table I, subgroup 2 herein.
4.4.2.1 Group B inspection, table E-VIa (JANS) of MIL-PRF-19500. For purposes of JANS inspection, a single
device type shall be defined as devices from a single wafer lot (for each die type used in the construction). The
conformance inspection sample shall be selected from the part category with the lowest VZ rating in the inspection
lot.
Method
Conditions
Subgroup
B1
2066
As specified.
B2
2026
As specified.
B2
1022
As specified.
B3
1056
Test Condition A, 25 cycles.
B3
4066
Not applicable.
B3
1071
Test condition E.
B3
2075
As specified.
B4
1037
IZ = 35 mA dc at TA = room ambient; ton = toff = 30 seconds minimum for
4,000 cycles. Forced air cooling allowed during off cycle.
IZM = 70 mA dc for 96 hours. TA +75C, adjust TA to achieve TJ = +200C
B5
1027
minimum.
B6
Not applicable.
10
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