MIL-PRF-19500-255 Semiconductor Device, Transistor, Npn, Silicon, Switching, Types 2N2221A, 2N2221Al, 2N2222A, 2N2222Al, 2N2221Aua, 2N2222Aua, 2N2221Aub, 2N2222Aub, 2N2221Aubc, And 2N2222Aubc, 2N2221Aubn, 2N2222Aubn, 2N2221Aubcn, 2N2222Aubcn, Jan, Jantx, Jantxv, Jantxvm, Jantxvd, Jantxvp, Jantxvl, Jantxvr, Jantxvf, Jantxvg, Jantxvh, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, ...This specification covers the performance requirements for NPN, silicon, switching transistors. Five levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500, and two levels of product assurance are provided for each unencapsulated device type. Provisions for radiation hardness assurance \(RHA\) to eight radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels. RHA level designators "M", "D", "P", "L", "R", "F", "G" and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/255Y

3.5 Radiation hardness assurance (RHA). Radiation hardness assurance requirements, PIN designators, and

test levels shall be as defined in MIL-PRF-19500.

3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

characteristics are as specified in paragraph 1.3, 1.4, and table I.

3.7 Electrical test requirements. The electrical test requirements shall be as specified in table I.

* 3.8 Marking. Marking shall be in accordance with MIL-PRF-19500, except for the UB, UBC, UBN, and UBCN

suffix packages. Marking on the UB, UBC, UBN, and UBCN packages shall consist of an abbreviated part number,

the date code, and the manufacturer's symbol or logo. The prefixes JAN, JANTX, JANTXV, and JANS can be

abbreviated as J, JX, JV, and JS respectively. The "2N" prefix and the "AUB" suffix can also be omitted. The

radiation hardened designator M, D, P, L, R, F, G, or H shall immediately precede (or replace) the device "2N"

identifier (depending upon degree of abbreviation required).

3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and

shall be free from other defects that will affect life, serviceability, or appearance.

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

a. Qualification inspection (see 4.2).

b. Screening (see 4.3).

c. Conformance inspection (see 4.4, and tables I and II).

4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as

specified herein.

4.2.1 JANHC and JANKC qualification. JANHC and JANKC qualification inspection shall be in accordance with

MIL-PRF-19500.

4.2.2 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In

case qualification was awarded to a prior revision of the specification sheet that did not request the performance of

table III tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on

the first inspection lot of this revision to maintain qualification.