MIL-PRF-19500-255 Semiconductor Device, Transistor, Npn, Silicon, Switching, Types 2N2221A, 2N2221Al, 2N2222A, 2N2222Al, 2N2221Aua, 2N2222Aua, 2N2221Aub, 2N2222Aub, 2N2221Aubc, And 2N2222Aubc, 2N2221Aubn, 2N2222Aubn, 2N2221Aubcn, 2N2222Aubcn, Jan, Jantx, Jantxv, Jantxvm, Jantxvd, Jantxvp, Jantxvl, Jantxvr, Jantxvf, Jantxvg, Jantxvh, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, ...This specification covers the performance requirements for NPN, silicon, switching transistors. Five levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500, and two levels of product assurance are provided for each unencapsulated device type. Provisions for radiation hardness assurance \(RHA\) to eight radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels. RHA level designators "M", "D", "P", "L", "R", "F", "G" and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/255Y

NOTES:

1. Die size:

.020 x .020 inch (0.508 mm x 0.508 mm).

2. Die thickness:

.008 �.0016 inch (0.2032 mm �0.04064 mm).

3. Base bonding pad:

.004 x .004 inch (0.1016 mm x 0.1016 mm).

4. Emitter bonding pad:

.004 x .004 inch.

5. Back metal:

Gold, 6,500 �1,950 �.

6. Top metal:

Aluminum, 27,000 �3,000 �.

7. Back side:

Collector.

SiO2, 7,500 �1,500 �.

8. Glassivation:

FIGURE 5. JANHC and JANKC (C-version) die dimensions.