MIL-PRF-19500-255 Semiconductor Device, Transistor, Npn, Silicon, Switching, Types 2N2221A, 2N2221Al, 2N2222A, 2N2222Al, 2N2221Aua, 2N2222Aua, 2N2221Aub, 2N2222Aub, 2N2221Aubc, And 2N2222Aubc, 2N2221Aubn, 2N2222Aubn, 2N2221Aubcn, 2N2222Aubcn, Jan, Jantx, Jantxv, Jantxvm, Jantxvd, Jantxvp, Jantxvl, Jantxvr, Jantxvf, Jantxvg, Jantxvh, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, ...This specification covers the performance requirements for NPN, silicon, switching transistors. Five levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500, and two levels of product assurance are provided for each unencapsulated device type. Provisions for radiation hardness assurance \(RHA\) to eight radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels. RHA level designators "M", "D", "P", "L", "R", "F", "G" and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/255Y

Physical characteristics:

B-version

NOTES:

.023 x .023 inch �.002 inch (0.584 mm x 0.584 mm �0.051 mm).

1. Chip size:

.010 �.0015 inch (0.254 mm �0.038 mm).

2. Chip thickness:

3. Top metal:

Aluminum 15,000� minimum, 18,000� nominal for JANHC.

AlSiCu 16,000� minimum, 18,000� nominal for JANKC.

4. Back metal:

Gold 4,500� minimum, 5,000� nominal.

Si3N4 2,000 � minimum, 8,000 � nominal for JANHC.

5. Glassivation:

SiON 8,500 � minimum, 9,000 � nominal for JANKC

6. Backside:

Collector.

7. Bonding pad:

B = .0042 x .0042 inch (0.107 mm x 0.107 mm).

E = .0042 x .0042 inch (0.107 mm x 0.107 mm).

FIGURE 4. JANHC and JANKC (B-version) die dimensions.