MIL-PRF-19500/286K
3.4 Diode construction. Except for the JANHC devices, these devices shall be constructed utilizing metallurgically
bonded, thermally matched, non-cavity, double-plug construction. The metallurgical bond between the chip and the
plug shall meet the category I requirement of MIL-PRF-19500, appendix A.
3.5 Interface and physical dimensions. Interface and physical dimensions shall be as specified in
MIL-PRF-19500, and on figure 1 and figure 2. No lead (Pb) shall be used in the construction of the die bonds.
3.5.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.7 Electrical test requirements. The electrical test requirements shall be group A as specified herein.
3.8 Marking. Marking shall be in accordance with MIL-PRF-19500. At the option of the manufacturer, marking
may be omitted from the body, but shall be retained on the initial container.
3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 Group E qualification. Group E qualification shall be performed herein for qualification or requalification only.
In case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on
the first inspection lot to this revision to maintain qualification.
* 4.2.2 JANHC die. Qualification shall be in accordance with appendix G of MIL-PRF-19500.
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