MIL-PRF-19500/313J
TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limits
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
n = 45 devices, c = 0
examination 3/
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Heremetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical
Table I, subgroup 2
measurements 4/
Precondition TA = +250°C at
2037
Bond strength 3/ 4/
t = 24 hrs or TA = +300°C at
t = 2 hrs n = 11 wires, c = 0
Decap internal visual design
2075
n = 4, c = 0.
verification 4/
Subgroup 2
°C/W
Thermal impedance
3131
See 4.3.3
ZθJX
Breakdown voltage collector to
3011
Bias condition D; IC = 10 mA dc;
V(BR)CEO
emitter
pulsed (see 4.5.1).
2N2432, 2N2432UB
30
V dc
2N2432A, 2N2432AUB
45
V dc
Collector to base cutoff current
3036
Bias condition D
ICBO1
µA dc
2N2432, 2N2432UB
100
VCB = 30 V dc
µA dc
2N2432A, 2N2432AUB
100
VCB = 45 V dc
Bias condition D; IE = 100 µA dc;
Breakdown voltage emitter to
3011
V(BR)ECO1
collector
IB = 0 (see 4.5.3).
2N2432, 2N2432UB
15
V dc
2N2432A, 2N2432AUB
18
V dc
Breakdown voltage emitter to
3011
10
V dc
V(BR)EC02
Bias condition D; IE = 10 mA dc;
collector
IB = 0; pulsed (see 4.5.1 and 4.5.3)
See footnotes at end of table.
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