MIL-PRF-19500/313J
NOTES:
.015 x .019 inch ±.001 inch, (0.38 x 0.48 ±0.02 millimeter).
1. Chip size
.010 ±.0015 inch, (0.25 ±0.04 millimeter).
2. Chip thickness
3. Top metal
Aluminum 15,000Å minimum, 18,000Å nominal.
* 4. Back metal
Gold 3,500Å minimum, 5,000Å nominal.
5. Backside
Collector
6. Bonding pad
B = .003 inch (0.08 millimeter).
E = .004 inch diameter (0.10 millimeter).
Si3N4 (Silicon Nitride) 5.6 kÅ min, 8 kÅ nom.
*
7. Passivation
*
8. See 6.4.
FIGURE 2. Physical dimensions, JANHCA and JANKCA (B - version) die.
4
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