MIL-PRF-19500/313J
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500 and as follows.
Forward current transfer ratio except that the collector and emitter shall be interchanged.
hFE(inv)
Emitter current (rms).
Ie
PCB
Printed circuit board.
rec(on
Small signal emitter to collector on state resistance.
Thermal resistance junction to ambient.
RθJA
Thermal resistance junction to case.
RθJC
Thermal resistance junction to solder pads.
RθJSP
VBC
Base to collector voltage.
V(BR)ECO
Breakdown voltage, emitter to collector, with base open circuited.
Emitter to collector offset voltage, i.e., open circuit voltage between emitter and collector when the
VEC(ofs)
base to collector junction is forward biased.
Emitter to collector voltage (rms).
Vec
3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in
MIL-PRF-19500, and on figures 1, 2, and 3.
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I.
3.6 Electrical test requirements. The electrical test requirements shall be as specified in table I.
3.7 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
*
c. Conformance inspection (see 4.4 and tables I and II and 4.5.7).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
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