MIL-PRF-19500/356L
* 1.3
Maximum ratings - Continued.
(1)
Derate: See figure 5 herein.
(2)
Derate: See figure 6 herein.
(3)
Derate: See figure 7 herein.
(4)
Derate: See figure 8 herein.
* (5)
For PCB ratings on all surface mount (US) devices, the pads = .061 inch (1.55 mm) x .168 inch (4.27 mm); for
the axial-leaded devices, the pads (axial) = .092 inch (2.34 mm) diameter, strip = .030 inch (0.762 mm) x 1
inch (25.4 mm) long, axial lead length L ≤ .187. Also see application data in 6.4 herein for further details in
various Copper pad sizes and weights for PCB mounting.
1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in maximum test ratings
herein (see 3.10) and as follows:
RθJL = 22°C/W
RθJL = 30°C/W
RθJEC = 7°C/W
RθJEC = 10°C/W
RθJA(PCB) =
150°C/W
(max)
(max)
(max)
(max)
L = .375 inch
L = .375 inch
L = 0 inch
L = 0 inch
(See note 5 in 1.3)
(9.53 mm)
(9.53 mm)
1N4954
1N5968, 1N5969,
1N4954US
1N5968US,
1N4954,US
through
1N6632
through
1N5969US,
through
1N4996
through
1N4996US
1N6632US
1N4996,US
1N6637
through
1N5968,US,
1N6637US
1N5969,US,
1N6632,US
through
1N6637,US
2. APPLICABLE DOCUMENTS
* 2.1 General. The documents listed in this section are specified in sections 3 or 4 of this specification. This section
does not include documents cited in other sections of this specification or recommended for additional information or
as examples. While every effort has been made to ensure the completeness of this list, document users are
cautioned that they must meet all specified requirements of documents cited in sections 3 or 4 of this specification,
whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
-
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
-
Test Methods for Semiconductor Devices.
* (Copies of these documents are available online at https://quicksearch.dla.mil/).
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
2
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