MIL-PRF-19500/356L
4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen
Measurements
(see table E-IV of
MIL-PRF-19500)
JANS level
JANTX and JANTXV levels
1a
Required
Not required
1b
Required
Required (JANTXV only)
2
Optional
Optional
3a
Required
Required
3b
Not applicable
Not applicable
(1) 3c
Thermal impedance, see 4.3.1
Thermal impedance, see 4.3.1
4
Not applicable
Not applicable
5
Not applicable
Not applicable
6
Not applicable
Not applicable
7a
Not applicable
Not applicable
7b
Optional
Optional
8
Required
Not required
9
IR1 and VZ
Not applicable
100 percent
10
Not applicable
IR1 and VZ, ĆIR1 ≤ ±100 percent of initial
11
IR1 and VZ
reading or 250 nA dc, whichever is greater.
ĆVZ ≤ ±2.5 percent of initial reading
12
Required, see 4.3.2
Required, see 4.3.2
13
Required, subgroups 2 and 3 of table I herein;
Required, subgroups 2 of table I herein;
ĆIR1 (max) ≤ ±100 percent of initial reading or
ĆIR1 (max) ≤ ±100 percent of initial reading or
250 nA, whichever is greater; ĆVZ ≤ ±2.5
25 percent of column 12 of table IV (1N6632 -
1N4964); 250 nA (1N4965 - 1N4996),
percent of initial reading, scope display, see
whichever is greater, ĆVZ ≤ ±2.5 percent of
4.5.6 herein
initial reading
14a
Not applicable
Not applicable
(2) 14b
Required
Required
15
Required
Not required
16
Required
Not required
(1) This test shall be performed anytime after screen 3.
(2) For clear glass diodes, the hermetic seal (gross leak) may be performed at any time after temperature cycling.
4.3.1 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3101 or 4081 of MIL-STD-750, as applicable, using the guidelines in that method for determining IM, IH, tH, tSW (VC
and VH where appropriate). Measurement delay time (tMD) = 70 µs max. See table II, group E, subgroup 4 herein.
4.3.2 Free air power burn-in conditions. Power burn-in conditions are as follows (see 4.5.5): TA = 75°C
maximum. Test conditions in accordance with method 1038 of MIL-STD-750, condition B. Adjust IZ or TA to achieve
the required TJ, and IZ(min) shall be ≥ 25 percent of column 8 of table IV. TJ = 135°C minimum. With approval of
the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias conditions, TJ, mounting conditions)
may be used for JANTX and JANTXV quality levels. A justification demonstrating equivalence is required. In
addition, the manufacturing site's burn-in data and performance history will be essential criteria for burn-in
modification approval (see 4.5.5 herein).
9
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