MIL-PRF-19500/356L
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500, and as follows.
αVZ
Temperature coefficient
C suffix
±2 percent voltage tolerance.
D suffix
±1 percent voltage tolerance.
IZM
Maximum zener current
IZSM
Maximum zener surge current
JANHC
High reliability product assurance level for unencapsulated devices.
JANKC
Space reliability product assurance level for unencapsulated devices.
TEC
Temperature, end cap.
US
Unleaded or surface mounted devices (square end caps).
ZK
Knee impedance
ZZ
Zener impedance
3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500,
3.4.1 Construction. All devices shall be metallugically bonded, double plug construction, thermally matched, and
noncavity in accordance with the requirements of MIL-PRF-19500. "US" version devices shall be structurally identical
to the axial leaded type except for lead attachment.
3.4.1.1 Metallurgical bond for diodes with VZ greater than 6.8 V dc. These devices shall be constructed utilizing
category I metallurgical bonds for diodes with VZ greater than 6.8 V dc as defined in MIL-PRF-19500 shall be utilized.
3.4.1.2 Metallurgical bond for diodes with VZ less than or equal to 6.8 V dc. These devices shall be constructed
utilizing category I or category III metallurgical bonds as defined in MIL-PRF-19500.
3.4.2 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.4.3 JANHC and JANKC metallization. Metallization on JANHC and JANKC is optional and may be specified on
the order.
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.5.1 Marking of US-version devices. At the option of the manufacturer, US-version devices may include laser
marking on an end cap, to include part number and lot date code for all levels. JANS levels shall also include
serialization. The prefixes JAN, JANTX, JANTXV, or JANS may be abbreviated as J, JX, JV, or JS, respectively.
(example: The part number may be reduced to JS4954). All device marking, except for polarity and serial numbers,
shall also appear on the unit package used as the initial protection for delivery.
3.5.2 Marking for JANHC and JANKC die. Marking of JANHC and JANKC die shall be in accordance with
MIL-PRF-19500.
3.6 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
When solder alloy is used for lead finish the maximum lead temperature shall be 175°C max. Where a choice of lead
finish is desired, it shall be specified in the acquisition document (see 6.2).
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