MIL-PRF-19500-357 Semiconductor Device, Transistor, Pnp, Silicon, Amplifier, Types 2N3634 Through 2N3637, 2N3634Ub Through 2N3637Ub, 2N3634Ubn Through 2N3637Ubn, 2N3634L Through 2N3637L, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhca, Jankca, Jankcam, Jankcad, Jankcap, Jankcal, Jankcar, Jankcaf, Jankcag, Jankcah, Janhcb, Jankcb, Jankcbm, Jankcbd,...This specification covers the performance requirements for PNP, silicon, low-power amplifier, and switching transistors. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500 and two levels of product assurance are provided for unencapsulated devices. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/357M

Chip size................024 x .026 inch �.002 inch (0.61 x 0.66 mm �0.051mm).

Chip thickness........010 �.0015 inch nominal (0.254 �0.038 mm).

Top metal................Aluminum 15,000� minimum, 18,000� nominal.

Back metal..............Gold 3,500� minimum, 5,000� nominal.

Backside.................Collector.

Bonding pad ...........B = .004 x .006 inch, (0.102 mm x 0.152 mm).

E = .004 x .0055 inch. (0.102 mm x 0.140 mm).

7. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.

* FIGURE 3. JANHCA and JANKCA die dimensions.