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MIL-PRF-19500-357 Semiconductor Device, Transistor, Pnp, Silicon, Amplifier, Types 2N3634 Through 2N3637, 2N3634Ub Through 2N3637Ub, 2N3634Ubn Through 2N3637Ubn, 2N3634L Through 2N3637L, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhca, Jankca, Jankcam, Jankcad, Jankcap, Jankcal, Jankcar, Jankcaf, Jankcag, Jankcah, Janhcb, Jankcb, Jankcbm, Jankcbd,...This specification covers the performance requirements for PNP, silicon, low-power amplifier, and switching transistors. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500 and two levels of product assurance are provided for unencapsulated devices. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/357M
1.
Chip size..................024 x .0259 inch nominal (0.61 x 0.66 mm).
2.
Chip thickness.........0079 inch nominal (0.21mm).
3.
Top metal................Aluminum 20,000Å nominal.
4.
Back metal..............12K Gold.
5.
Backside. ...............Collector.
In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
*
6.
* FIGURE 4. JANHCB and JANKCB die dimensions.
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