[INCH-POUND
The documentation and process conversion measures
necessary to comply with this document shall be
MIL-PRF-19500/382J
completed by 18 June 2012.
18 April 2012
SUPERSEDING
MIL-PRF-19500/382H
16 June 2010
PERFORMANCE SPECIFICATION SHEET
* SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON, LOW-POWER,
TYPES 2N2944A, 2N2945A, 2N2945AM, AND 2N2946A, 2N2944AUB, 2N2945AUB, 2N2945AUBM,
AND 2N2946AUB, JAN, JANTX, JANTXV, JANS, JANHC, JANKC, JANSM, JANSD, JANSP, JANSL,
JANSR, JANSF, JANSG, JANSH, JANHCM, JANHCD, JANHCP, JANHCL, JANHCR, JANHCF, JANHCG,
JANHCH, JANKCM, JANKCD, JANKCP, JANKCL, JANKCR, JANKCF, JANKCG, AND JANKCH
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
* 1.1 Scope. This specification covers the performance requirements for low-power, high-speed chopper, PNP,
silicon transistors. A `M' and UB'M' suffix will indicate a matched pair. Four levels of product assurance are provided
for each encapsulated device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for
each unencapsulated device type. Radiation hardness assurance (RHA) level designators "M", "D", "P", "L", "R", "F",
"G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements.
1.2 Physical dimensions. See figure 1 (similar to TO-46), figure 2 (surface mount), and figure 3 (die).
1.3 Maximum ratings, unless otherwise specified TA = +25°C.
Types
PT
PT
VEBO
VCBO
VCEO
VECO
IC
TJ and
RθJA
RθJSP
TA = +25°C
TSP = +25°C
TSTG
(3) (4)
(1) (2)
(1) (2)
°C
°C/W
°C/W
mW
mW
V dc
V dc
V dc
V dc
mA dc
2N2944A
400
N/A
-15
-15
-10
-10
-100
-65 to
435
N/A
2N2945A, AM
400
N/A
-25
-25
-20
-20
-100
+200
435
N/A
2N2946A
400
N/A
-40
-40
-35
-35
-100
435
N/A
2N2944AUB
400
800
-15
-15
-10
-10
-100
-65 to
435 (5)
90
2N2945AUB
400
800
-25
-25
-20
-20
-100
+200
435 (5)
90
2N2945AUBM
400
800
-25
-25
-20
-20
-100
435 (5)
90
2N2946AUB
400
800
-40
-40
-35
-35
-100
435 (5)
90
(1) For derating, see figures 4 and 5.
(2) See 3.3 for abbreviations.
(3) For thermal curves, see figures 6 and 7.
* Comments, suggestions, or questions on this document should be to DLA Land and Maritime, ATTN: VAC,
P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dla.mil. Since contact information
can change, you may want to verify the currency of this address information using the ASSIST Online database
AMSC N/A
FSC 5961
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