MIL-PRF-19500-382 Semiconductor Device, Transistor, Pnp, Silicon, Low-Power, Types 2N2944A, 2N2945A, 2N2945Am, And 2N2946A, 2N2944Aub, 2N2945Aub, 2N2945Aubm, And 2N2946Aub, Jan, Jantx, Jantxv, Jans, Janhc, Jankc, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhcm, Janhcd, Janhcp, Janhcl, Janhcr, Janhcf, Janhcg, Janhch, Jankcm, Jankcd, Jankcp, Jankcl, Jankcr, Jankcf, Jankcg, A...This specification covers the performance requirements for low-power, high-speed chopper, PNP, silicon transistors. A ┬æM┬Æ and UB┬ÆM┬Æ suffix will indicate a matched pair. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type. Radiation hardness assurance \(RHA\) level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements.

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MIL-PRF-19500/382J

4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following

requirements:

a. For JAN, JANTX, and JANTXV samples shall be selected randomly from a minimum of three wafers (or from

each wafer in the lot) from each wafer lot. For JANS, samples shall be selected from each inspection lot.

See MIL-PRF-19500.

b. Shall be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2,

conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high

temperature, the samples for life test (subgroups B4 and B5 for JANS, and group B for JAN, JANTX, and

JANTXV) may be pulled prior to the application of final lead finish.

4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the tests and conditions

specified for subgroup testing in table E-VII of MIL-PRF-19500, and 4.4.3.1 (JANS), and 4.4.3.2 (JAN, JANTX, and

JANTXV) herein for group C testing. Electrical measurements (end-points) and delta requirements shall be in

accordance with table I, subgroup 2 and 4.5.6 herein.

4.4.3.1 Group C inspection, table E-VII (JANS) of MIL-PRF-19500.

Subgroup

Method

Condition

2036

Test condition E (not applicable to UB).

RθJA only, as applicable (see 1.3) and in accordance thermal impedance curves on

3131

figures 6 and 7.

1026

Steady-state life: 1,000 hours, VCB = 10 V dc; power shall be applied to achieve

TJ = +150�C minimum and a minimum of PD = 75 percent of maximum rated PT

as defined in 1.3 n = 45, c = 0. The sample size may be increased and the test time

decreased as long as the devices are stressed for a total of 45,000 device hours

minimum, and the actual time of test is at least 340 hours.

4.4.3.2 Group C inspection, table E-VII (JAN, JANTX, and JANTXV) of MIL-PRF-19500.

Subgroup

Method

Condition

2036

Test condition E (not applicable to UB).

RθJA only, as applicable (see 1.3) and in accordance thermal impedance curves on

3131

figures 6 and 7.

1037

Not applicable.

4.4.3.3 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any

inspection lot containing the intended package type and lead finish procured to the same specification which is

submitted to and passes table I tests herein for conformance inspection. When the final lead finish is solder or any

plating prone to oxidation at high temperature, the samples for C6 life test may be pulled prior to the application of

final lead finish. Testing of a subgroup using a single device type enclosed in the intended package type shall be

considered as complying with the requirements for that subgroup.