MIL-PRF-19500/382J
TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limits
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical 3/
2071
examination
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to 3/ 4/ 5/
1022
n = 15 devices, c = 0
solvent
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles,
n = 22 devices, c = o
Electrical measurements
Table I, subgroup 2 herein
4/
Heremetic seal 4/ 6/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Precondition TA = +250°C at
Bond strength 3/ 4/
2037
t = 24 hrs or TA = +300°C at
t = 2 hrs, n = 11 wires, c = 0
Decap internal visual
2075
n = 4 devices, c = 0
(design verification) 4/
Subgroup 2
See 4.3.3
°C/W
Thermal impedance
3131
ZθJX
Bias condition D;
Breakdown voltage
3011
V(BR)CEO
IC = -10 µA dc
collector to emitter 7/
2N2944A, UB
-10
V dc
2N2945A, UB, UBM
-20
V dc
2N2946A, UB
-35
V dc
Bias condition D
Collector to base
3036
ICBO1
cutoff current 7/
µA dc
VCB = -15 V dc
2N2944A, UB
10
VCB = -25 V dc
µA dc
2N2945A, UB, UBM
10
VCB = -40 V dc
µA dc
2N2946A, UB
10
See footnotes at the end of table.
13
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