MIL-PRF-19500-382 Semiconductor Device, Transistor, Pnp, Silicon, Low-Power, Types 2N2944A, 2N2945A, 2N2945Am, And 2N2946A, 2N2944Aub, 2N2945Aub, 2N2945Aubm, And 2N2946Aub, Jan, Jantx, Jantxv, Jans, Janhc, Jankc, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhcm, Janhcd, Janhcp, Janhcl, Janhcr, Janhcf, Janhcg, Janhch, Jankcm, Jankcd, Jankcp, Jankcl, Jankcr, Jankcf, Jankcg, A...This specification covers the performance requirements for low-power, high-speed chopper, PNP, silicon transistors. A ┬æM┬Æ and UB┬ÆM┬Æ suffix will indicate a matched pair. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type. Radiation hardness assurance \(RHA\) level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements.

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MIL-PRF-19500/382J

Die size:

.020 x .020 inch (0.508 mm x 0.508 mm).

.008 �.0016 inch (0.203 mm �0.041 mm).

Die thickness:

Base pad:

.002 x .003 inch (0.051 mm x 0.076 mm).

Emitter pad:

.004 x .004 inch (0.102 mm x 0.102 mm).

Back metal:

Gold, 6,500 �1,950 Ang.

Top metal:

Aluminum, 14,500 �2,500 Ang.

Back side:

Collector.

SiO2, 7,500 �1,500 Ang.

Glassivation:

FIGURE 3. Physical dimensions, JANKCA2N2944A through 2N2946A die

(also valid for JANHCA2N2944A through 2N2946A).