MIL-PRF-19500/392J
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table IV of
Measurements
MIL-PRF-19500)
JANTX and JANTXV levels
(1) 3c
Thermal impedance, method 3131 of MIL-STD-750. See
7
Optional
9
Not applicable.
10
24 hours minimum.
11
ICBO2, hFE4
12
See 4.3.1.
13
Subgroup 2 of table I herein;
ĆICBO2 = 100 percent of initial value or 5 nA dc
whichever is greater. ĆhFE4 = ±15 percent.
14
Required
(1)
Shall be performed anytime after temperature cycling, screen 3a; and does not need to be repeated in
screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCB = 10 - 30 V dc. Power shall be
applied to achieve TJ = +135°C minimum using a minimum PD = 75 percent of PT maximum rated as defined in 1.3.
With approval of the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias conditions, TJ, and
mounting conditions) may be used for JANTX and JANTXV quality levels. A justification demonstrating equivalence
is required. In addition, the manufacturing site's burn-in data and performance history will be essential criteria for
burn-in modification approval.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with
method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW (VC and VH where
5
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