MIL-PRF-19500/392J
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limit
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
*
inspection 3/
Solderability 3/
2026
n = 15 leads, c = 0.
Resistance to solvents
1022
n = 15 devices, c = 0.
3/ 4/
Temp cycling 3/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0.
Heremetic seal
1071
n = 22 devices, c = 0.
Fine leak
Gross leak
Electrical
Table I, subgroup 2.
measurements
Precondition TA = +250°C at
Bond strength 3/
2037
t = 24 hours or TA = +300°C at
t = 2 hours n = 11 wires, c = 0.
Decap internal visual
2075
n = 4, c = 0.
(design verification)
Subgroup 2
°C/W
Thermal impedance
3131
See 4.3.2.
ZθJX
µA dc
Collector to base cutoff
3036
10
Bias condition D; VCB = 60 V dc.
ICBO1
current
µA dc
Emitter to base cutoff
3061
10
Bias condition D; VEB = 5 V dc.
IEBO1
current
Breakdown voltage,
3011
60
V dc
Bias condition. D; IC = 10 mA dc
V(BR)CEO
collector to emitter
pulsed (see 4.5.1).
Collector to base cutoff
3036
10
nA dc
Bias condition D; VCB = 50 V dc.
ICBO2
current
See footnotes at end of table.
8
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