MIL-PRF-19500/392J
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E-V of
MIL-PRF-19500 and table I herein.
* 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIc of MIL-PRF-19500 and 4.4.2.1. Electrical measurements (end-points) and delta
requirements for JAN, JANTX, and JANTXV shall be after each step in 4.4.2.1 and shall be in accordance with table
4.4.2.1 Group B inspection, (JAN, JANTX, and JANTXV). Separate samples may be used for each step. In the
event of a lot failure, the resubmission requirements of MIL-PRF-19500 shall apply. In addition, all catastrophic
failures during CI shall be analyzed to the extent possible to identify root cause and corrective action. Whenever a
failure is identified as wafer lot and /or wafer processing related, the entire wafer lot and related devices assembled
from the wafer lot shall be rejected unless an appropriate determined corrective action to eliminate the failure mode
has been implemented and the devices from the wafer lot are screened to eliminate the failure mode.
Step
Method
Condition
Steady-state life: 1,000 hours minimum, VCB = 10 V dc, power shall be applied to achieve
1
1026
TJ = +150°C minimum using a minimum of PD = 75 percent of maximum rated PT as defined
in 1.3. n = 45 devices, c = 0. The sample size may be increased and the test time
decreased as long as the devices are stressed for a total of 45,000 device hours minimum,
and the actual time of test is at least 340 hours.
Blocking life, TA = +150°C, VCB = 80 percent of rated voltage, 48 hours minimum.
2
1048
n = 45 devices, c = 0.
High-temperature life (non-operating), t = 340 hours, TA = +200°C. n = 22, c = 0.
3
1032
4.4.2.2 Group B sample selection. Samples selected from group B inspection shall meet all of the following
requirements.
a. For JAN, JANTX, and JANTXV samples shall be selected randomly from a minimum of three wafers (or
from each wafer in the lot) from each wafer lot. See MIL-PRF-19500.
b. Shall be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2,
conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high
temperature, the samples for life test (group B for JAN, JANTX, and JANTXV) may be pulled prior to the
application of final lead finish.
* 4.4.3 Group C inspection, Group C inspection shall be conducted in accordance with the conditions specified in
table E-VII of MIL-PRF-19500 and 4.4.3.1 (JAN, JANTX, and JANTXV) herein for group C testing. Electrical
measurements (end-points) and delta requirements shall be in accordance with table I, subgroup 2 and 4.5.2 herein.
4.4.3.1 Group C inspection, table E-VII (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup
Method
Condition
C2
2036
Test condition E.
C5
3131
thermal impedance curves.
C6
Not applicable.
6
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