MIL-PRF-19500/399F
TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limits
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and
2071
n = 45 devices, c = 0
mechanical
inspection 3/
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to
1022
n = 15 devices, c = 0
solvents
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Hermetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Test conditions G or H
Gross leak
Test conditions C or D
Electrical
Table I, subgroup 2
measurements 4/
Bond strength 3/ 4/
2037
Precondition
TA = +250°C at t = 24 hrs or
TA = +300°C at t = 2 hrs
n = 11 wires, c = 0
De-cap internal visual
2075
n = 4, c = 0
Subgroup 2
Thermal impedance
3131
See 4.3.3
mV
ĆVBE
Collector to base
3036
Bias condition D,
10
µA dc
ICBO
VCB = 20 V dc
cutoff current
Bias condition D, VEB = 4.5 V dc
Emitter to base cutoff
10
3061
µA dc
IEBO
current
Breakdown voltage,
12
V dc
3011
Bias condition D, IC = 10 µA dc,
V(BR)CEO
collector to emitter
pulsed (see 4.5.1)
ICEX1
Collector to emitter
3041
Bias condition A;
1.0
µA dc
VCE = 10 V dc, VBE = 0.4 V dc
cutoff current
ICEX2
Collector to emitter
3041
Bias condition A;
5.0
nA dc
VCE = 10 V dc, VBE = 2.0 V dc
cutoff current
VCE = 1 V dc; IC = 1.0 mA dc
hFE1
40
Forward-current
3076
transfer ratio
See footnotes at end of table.
10
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