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MIL-PRF-19500-399 Semiconductor Device, Transistor, Npn, Silicon, Switching Type 2N3960 And 2N3960Ub Jan, Jantx, Jantxv, Jantxvm, Jantxvd, Jantxvp, Jantxvl, Jantxvr, Jantxvf, Jantxvg, Jantxvh, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhc, Janhcm, Janhcd, Janhcp, Janhcl, Janhcr, Janhcf, Janhcg, Janhch, Jankc, Jankcm, Jankcd, Jankcp, Jankcl, Jankcr, Jankcf, Jankcg, A...This specification covers the performance requirements for NPN silicon, switching transistors. Four levels of product assurance are provided for each device type and two levels for unencapsulated die as specified in MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements.

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MIL-PRF-19500/399F
4.4.3.1 Group C inspection, table E-VII (JANS) of MIL-PRF-19500.
Subgroup
Method
Conditions
C2
2036
Test condition E, not applicable to UB.
C6
1026
VCB = 10 V dc, 1,000 hours; maximum rated power shall be applied and TA
adjusted to achieve TJ = +150°C minimum and a minimum of PD = 75 percent of
maximum rated PT as defined in 1.3.
4.4.3.2 Group C inspection, table VII (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Method
Condition
Subgroup
C2
2036
Test condition E, (method 2036 not applicable for UB devices).
C6
1026
Not applicable.
4.4.3.3 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any
inspection lot containing the intended package type and lead finish procured to the same specification which is
submitted to and passes group A tests for conformance inspection. When the final lead finish is solder or any plating
prone to oxidation at high temperature, the samples for C6 life test may be pulled prior to the application of final lead
finish. Testing of a subgroup using a single device type enclosed in the intended package type shall be considered
as complying with the requirements for that subgroup.
4.4.4 Group D inspection. Conformance inspection for hardness assured JANS and JANTXV types shall include
the group D tests specified in table II herein. These tests shall be performed as required in accordance with
MIL-PRF-19500 and method 1019 of MIL-STD-750 for total ionizing dose, or method 1017 of MIL-STD-750 for
neutron fluence, as applicable (see 6.2 herein), except group D, subgroup 2 may be performed separate from other
subgroups. Group D inspection may also be performed ahead of the screening lot using die selected in accordance
with MIL-PRF-19500 and related documents. Alternate package options may also be substituted for the testing
provided there is no adverse effect to the fluence profile.
4.4.5 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500 and as specified in table IV herein. Electrical measurements
(end-points) and the delta requirements shall be in accordance with table I, subgroup 2 and the delta requirements in
accordance with the notes of table III herein.
4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
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