MIL-PRF-19500/406L
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Voltage regulation (VZ(reg)). The breakdown voltage shall be measured at IZ = 10 percent of column 8 of
table III and at IZ = 50 percent of column 8 of table III. The difference between these voltages shall then be
determined and shall not exceed column 9 of table III. The voltage measurement at IZ = 10 percent of column 8 of
table III shall be a pulse measurement in accordance with 4.5.5. The measurement at IZ = 50 percent of column 8 of
table III shall be made after current has been applied for 30 ±3 seconds. For this time interval, the device shall be
suspended in free air by its leads with mounting clips with inside edge .375 inch (9.53 mm) from the body, and the
point of connection shall be maintained at a temperature of +25°C, +8°C, -2°C. No forced air across the device shall
be permitted. US suffix devices shall be mounted with the end-caps maintained at +25°C, +8°C, -2°C. For JANHC
and JANKC, the die shall be stabilized at +25°C and the test shall be performed utilizing pulse conditions. The ĆVZ
measurement may be performed after a shorter time interval following application of the test current if correlation can
be established to the satisfaction of the qualifying activity.
4.5.2 Surge current (IZSM). The peak currents specified in column 10 of table III shall be applied in the reverse
direction and shall be superimposed on the current (IZ = column 5 of table III) a total of five surges at 1 minute
intervals. Each individual surge shall be at one-half square wave pulse of 8.3 millisecond duration or an equivalent
sine wave with the same effective (rms) current.
4.5.3 Temperature coefficient of regulator voltage (αVZ). The device shall be temperature stabilized with current
applied prior to reading regulator voltage at the specified ambient temperature.
4.5.4 Regulator voltage. The test current (column 5 of table III) shall be applied until thermal equilibrium is
attained prior to reading the regulator voltage. For this test, the diode shall be suspended by its leads (non-surface
mount) with mounting clips whose inside edge is located at .375 ± .010 inch (9.53 ±0.25 mm) from the body and the
lead temperature at inside edge of the mounting clips shall be maintained at a temperature of +23°C to +33°C. For
surface mount diodes, the diode shall be suspended by the end-caps with the temperature of the end-caps being
maintained at +23°C to +33°C. This measurement may be performed after a shorter time following application of the
test current than that which provides thermal equilibrium if correlation to stabilized readings can be established to the
satisfaction of the qualifying activity.
4.5.5 Pulse measurements. Conditions for pulse measurements shall be as specified in section 4 of
MILSTD750.
4.5.6 Free air power burn-in and life tests. The use of a current limiting or ballast resistor is permitted provided
that each DUT still sees at least IZ(min) described in 4.3.2 and that the minimum applied voltage, where applicable, is
maintained through-out the burn-in period. Use method 3100 of MIL-STD-750 to measure TJ.
4.5.7 Scope display evaluation. Scope display evaluation shall be sharp and stable in accordance with method
4023 of MILSTD750. Scope display may be performed on ATE (automatic test equipment) for screening only, with
the approval of the qualifying activity. Scope display in table I, subgroup 4 shall be performed on a scope. The
reverse current (IBR) over the knee shall be 500 µA peak.
4.5.7.1 Scope display option. At the suppliers option, 100-percent scope display evaluation may be discontinued
after three consecutive lots are 100-percent tested with zero failures. Any table I failure shall require 100-percent
scope display to be re-invoked.
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