MIL-PRF-19500/406L
3.8. Selection of tighter tolerance devices. The C and D suffix devices shall be selected from JAN, JANTX,
JANTXV, or JANS devices, which have successfully completed all applicable screening, and groups A, B, and C
testing as ±5 percent tolerance devices. All sublots of C and D suffix devices shall pass table I, subgroup 2, at
tightened tolerances. Tighter tolerances for mounting clip temperature shall be maintained for reference purposes to
establish correlation. For C and D tolerance levels, TL = 25°C, +1°C, -3°C at .375 inch (9.53 mm) from body, or zero
inches for surface mount devices or equivalent.
3.9 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.10 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.
3.11 Maximum and primary test ratings. Maximum and primary test ratings for voltage regulator diodes are specified
in table III herein.
3.12 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MILPRF19500, and as specified
herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or requalification only. In case
qualification was awarded to a prior revision of the specification sheet that did not request the performance of table II
tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on the first
inspection lot of this revision to maintain qualification.
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