MIL-PRF-19500/406L
A-Pkg MELF/Axial Thermal Resistance vs FR4 Pad Area
Still Air, PCB Horizontal
1000
100
1oz Foil
2oz Foil
3oz Foil
10
0.001
0.01
0.1
1
10
100
Pad Area (in2)
NOTE:
1. See figure 13 for UM package.
FIGURE 15. Thermal resistance versus FR4 pad area still air, PCB horizontal (for each pad) with
1 oz copper (top curve), 2 oz copper (middle curve), and 3 oz copper (bottom curve).
29
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