MIL-PRF-19500/426H
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limit
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
inspection 3/
Solderability 3/ 4/
2026
15 leads, c = 0
Resistance to solvents
1022
15 devices, c = 0
3/ 4/ 5/
Temperature cycling
1051
Test condition C, 25 cycles.
3/ 4/
n = 22 devices, c = 0
Hermetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical measurements
Table I, subgroup 2
4/
Precondition TA = +250°C
Bond strength 3/ 4/
2037
at t = 24 hrs or TA = +300°C
at t = 2 hrs. n = 11 wires, c = 0
Decap internal visual
2075
n = 4, c = 0
Subgroup 2
ĆVBE
Thermal impedance
3131
See 4.3.3
Breakdown voltage,
3011
V dc
-30
Bias condition D; IC = -1.0 mA dc,
V(BR)CEO
collector to emitter
IB = 0
Collector to base cutoff
3036
nA dc
-100
ICB01
Bias condition D; VCB = -20 V dc,
current
IE = 0
µA dc
Collector to base cutoff
3036
-100
ICB02
Bias condition D; VCB = -30 V dc
current
µA dc
Emitter to base cutoff
3061
-100
IEB0
Bias condition D; VEB = -3 V dc
current
Forward-current transfer
3076
15
hFE1
VCE = -10 V dc; IC = -0.5 mA dc
ratio
Forward-current transfer
3076
20
hFE2
VCE = -10 V dc; IC = -2.0 mA dc
ratio
Forward-current transfer
3076
30
165
hFE3
VCE = -10 V dc; IC = -5.0 mA dc
ratio
See footnotes at end of table.
11
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