MIL-PRF-19500/534G
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Limit
Unit
Symbol
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
*
examination 3/
Solderability 3/ 4/
2026
n = 15 leads, c = 0.
Resistance to solvents
1022
n = 15 devices, c = 0.
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0.
Hermetic seal 4/ 6/
1071
n = 22 devices, c = 0.
Fine leak
Gross leak
Electrical measurements 4/
Table I, subgroup 2.
Bond strength 3/ 4/
2037
Precondition
TA = +250°C at t = 24 hours or
TA = +300°C at t = 2 hours
n = 11 wires, c = 0.
Decap internal visual (design
2075
n = 4 devices, c = 0.
verification) 4/
Subgroup 2
See 4.3.3.
3131
Thermal impedance 7/
°C/W
ZθJX
Breakdown voltage,
3011
80
V dc
Bias condition D, IC = 100 mA,
VBR(CEO)
collector to emitter
Collector to emitter cutoff
3041
1.0
µA dc
Bias condition C, VCE = 60 V dc,
ICES1
current
VBE = 0.
Collector to emitter cutoff
3041
1.0
mA dc
ICES2
Bias condition C, VCE = 100 V dc,
current
VBE = 0.
Collector to emitter cutoff
3041
50
µA dc
Bias condition D, VCE = 40 V dc,
ICEO
current
IB = 0.
Emitter to base cutoff current
3061
1.0
mA dc
Bias condition C, VEB = 4 V dc,
IEBO1
IC = 0.
Emitter to base cutoff current
3061
1.0
mA dc
Bias condition D, VEB = 5.5 V dc,
IEBO2
IC = 0.
See footnotes at end of table.
10
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