MIL-PRF-19500-534 Semiconductor Device, Transistor, Npn, Silicon, Power, Types 2N5002 And 2N5004, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhcb, Jankcb, Jankcbm, Jankcbd, Jankcbp, Jankcbl, Jankcbr, Jankcbf, Jankcbg, And JankcbhThis specification covers the performance requirements for NPN, silicon, power transistors for use in high-speed power-switching applications. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. Two levels of product assurance for each unencapsulated device type die. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/534G

4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following

requirements:

a. For JAN, JANTX, and JANTXV samples shall be selected randomly from a minimum of three wafers (or from

each wafer in the lot) from each wafer. For JANS, samples shall be selected from each inspection lot.

See MIL-PRF-19500.

b. Shall be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2

conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high

temperature, the samples for life test (subgroups B4 and B5 for JANS, and group B for JAN, JANJ, JANTX,

and JANTXV) may be pulled prior to the application of final lead finish.

4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the tests and conditions

specified for subgroup testing in table E-VII of MIL-PRF-19500 and in 4.4.3.1 (JANS) and 4.4.3.2 (JAN, JANTX, and

JANTXV) herein for group C testing. Electrical measurements (end-points) shall be in accordance with table I,

subgroup 2. Delta requirements shall be in accordance with the steps of 4.5.3 herein as specified in the notes for

4.5.3.

4.4.3.1 Group C inspection (JANS), table E-VII of MIL-PRF-19500.

Subgroup

Method

Condition

2036

Tension: Test condition A, weight = 7 pounds, �5 ounces, application time = 15 s.

Terminal torque: Test condition D1, torque = 6 inch-ounce, application time = 15 s.

Stud torque: Test condition D2, torque = 15 inch-pounds, application time = 15 s.

RθJA and RθJC only, as applicable (see 1.3) and applied thermal impedance curves.

3131

1026

1,000 hours at VCB = 10 V dc; power shall be applied to achieve TJ = +150�C minimum

and a minimum of PD = 75 percent of maximum rated PT as defined in 1.3 n = 45, c = 0.

The sample size may be increased and the test time decreased as long as the devices

are stressed for a total of 45,000 device hours minimum, and the actual time of test is at

least 340 hours.

4.4.3.2 Group C inspection (JAN, JANTX, and JANTXV), table E-VII of MIL-PRF-19500.

Method

Condition

Subgroup

2036

Tension: Test condition A, weight = 7 pounds, �5 ounces, application time = 15 s.

Terminal torque: Test condition D1, torque = 6 inch-ounce, application time = 15 s.

Stud torque: Test condition D2, torque = 15 inch-pounds, application time = 15 s.

3131

RθJA and RθJC only, as applicable (see 1.3) and in accordance with thermal impedance

curves.

Not applicable.

4.4.3.3 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any

inspection lot containing the intended package type and lead finish procured to the same specification which is

submitted to and passes table I tests herein for conformance inspection. When the final lead finish is solder or any

plating prone to oxidation at high temperature, the samples for C6 life test may be pulled prior to the application of

final lead finish. Testing of a subgroup using a single device type enclosed in the intended package type shall be

considered as complying with the requirements for that subgroup.