MIL-PRF-19500/560L
* TABLE I. Group A inspection.
MIL-STD-750
Limit
Symbol
Unit
Inspection 1/
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
n = 45 devices, c = 0
examination 3/
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Heremetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical measurements
Table I, subgroup 2
4/
Bond strength 3/ 4/
2037
Test condition D,
*
Precondition
TA = +250°C at t = 24 hrs or
TA = +300°C at t = 2 hrs
n = 11 wires, c = 0
Decap internal visual
2075
n = 4 device, c = 0
(design verification) 4/
Subgroup 2
°C/W
Thermal impedance
3131
See 4.3.3
ZθJX
Breakdown voltage,
3011
100
V dc
Bias condition D; IC = 50 mA dc; pulsed
V(BR)CEO
collector to emitter
(see 4.5.1)
µA dc
Collector to emitter cutoff
3041
100
Bias condition D; VCE = 100 V dc
ICEO
current
µA dc
Collector to emitter cutoff
3041
1
Bias condition A; VBE = 1.5 V dc;
ICEX1
current
VCE = 90 V dc
µA dc
Collector to base cutoff
3036
1
Bias condition D; VCB = 100 V dc
ICBO
current
See footnotes at end of table.
12
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