MIL-PRF-19500-560 Semiconductor Device, Transistor, Npn, Silicon, Switching, Type 2N5339 And 2N5339U3, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhcc, Jankcc, Jankccm, Jankccd, Jankccp, Jankccl, Jankccr, Jankccf, Jankccg, And JankcchThis specification covers the performance requirements for NPN silicon switching transistors. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500 and two levels of product assurance are provided for each unencapsulated device type as specified in MIL-PRF-19500. Provisions for radiation hardness assurance \(RHA\) to eight radiation levels is provided for JANS and JANKC product assurance levels. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/560L

NOTES:

.128 x .128 inch �.002 inch (3.25 x 3.25 �0.051 mm).

Chip size:

.010 �.002 inch (0.254 �0.0508 mm) nominal.

Chip thickness:

Top metal:

Aluminum 30,000� minimum, 33,000� nominal.

Back metal:

Gold 3,500� minimum, 5,000� nominal.

Backside:

Collector.

Bonding pad:

B = .052 x .012 inch (1.321 x 0.305 mm), E = .084 x .012 inch (2.134 x 0.305 mm).

FIGURE 4. Physical dimensions JANHC and JANKC D-version die dimensions.