MIL-PRF-19500/560L
4.4.2.2 Group B inspection, (JAN, JANTX, and JANTXV). Separate samples may be used for each step. In the
event of a lot failure, the resubmission requirements of MIL-PRF-19500 shall apply. In addition, all catastrophic
failures during CI shall be analyzed to the extent possible to identify root cause and corrective action. Whenever a
failure is identified as wafer lot or wafer processing related, the entire wafer lot and related devices assembled from
the wafer lot shall be rejected unless an appropriate determined corrective action to eliminate the failures mode has
been implemented and the devices from the wafer lot are screened to eliminate the failure mode.
Step
Method
Condition
1
1026
Steady-state life: 1,000 hours minimum, VCB = 10 V dc, power shall be applied to
achieve TJ = +150°C minimum using a minimum of PD = 75 percent of maximum
increased and the test time decreased as long as the devices are stressed for a total
of 45,000 device hours minimum, and the actual time of test is at least 340 hours.
n = 45, c = 0. Blocking life, TA = +150°C, VCB = 80 percent of rated voltage, 48
2
1048
hours minimum. n = 45 devices, c = 0.
High- temperature life (non-operating), t = 340 hours, TA = +200°C. n = 22, c = 0.
3
1032
4.4.3 Group C inspection, Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500 and herein. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein.
*
4.4.3.1 Group C inspection, table E-VII of MIL-PRF-19500.
Subgroup
Method
Condition
C2
2036
Test condition E, N/A for U3 devices.
C5
3131
See 4.3.3.
For solder die attach: VCB ≥ 10 V dc, TA = room ambient as defined in the
*
C6
1037
general requirements of MIL-STD-750. For JANS only.
For JANS only. For eutectic die attach: VCB ≥ 10 V dc, adjust PT to achieve
C6
1026
TJ = +175°C min, 1,000 hours.
4.4.4 Group D inspection. Conformance inspection for hardness assured JANS and JANKC types shall include
the group D tests specified in table II herein. These tests shall be performed as required in accordance with
MIL-PRF-19500 and method 1019 of MIL-STD-750, for total ionizing dose or method 1017 of MIL-STD-750 for
neutron fluence as applicable (see 6.2.f herein), except group D, subgroup 2 may be performed separate from other
subgroups. Group D inspection may also be performed ahead of the screening lot using die selected in accordance
with MIL-PRF-19500 and related documents. Alternate package options may also be substituted for the testing
provided there is no adverse effect to the fluence profile.
4.4.5 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500, and as specified in table III herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein.
4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of
MIL-STD-750.
4.5.2 Input capacitance. This test shall be conducted in accordance with method 3240 of MIL-STD-750, except
the output capacitor shall be omitted.
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