MIL-PRF-19500/610F
minimum, die shall be 100 percent probed in accordance with table 1, subgroup 2.
4.3.2 Burn-in conditions. Burn-in conditions are as follows: IF = 200 mA dc. Mounting and test conditions in
4.3.2.1 Mounting. Devices may be mounted using any convenient method including the temporary attachment of
leads on UR suffix devices, provided that the parts are burned-in at TJ ≥ +110�C.
4.3.3 Thermal impedance (ZθJX measurements). The ZθJX measurements shall be performed in accordance with
method 3101 of MIL-STD-750. The maximum screen limit shall be developed by the supplier using statistical
methods and it shall not exceed table 1, subgroup 2 herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E-V of MIL-PRF-19500
a. IM measurement current ....................................................... 1 mA to 10 mA.
b. IH forward heating current .................................................... 0.5 A to 1.0 A.
c. tH heating time ...................................................................... 10 ms.
d. tMD measurement delay time ................................................ 70 �s maximum.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIA (JANS), and table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500. Electrical
measurements (end-points) shall be in accordance with the applicable inspections of table I, subgroup 2 herein.
Subgroup
Method
Condition
-55�C to 100�C, 25 cycles, n = 22, c = 0.
B3
1056
-55�C to 150�C, 100 cycles, n = 22, c = 0.
1051
IFSM = 5 A(pk), condition A 2, IO = 200 mA; TA = room ambient as
B3
4066
of 8.3 ms each at 1 minute intervals.
B4
1036
IO = 200 mA; TA = room ambient as defined in the general requirements
minutes minimum for 2,000 cycles.
IF = 200 mA dc minimum, adjust IF or TA to achieve TJ = + 125�C
B5
1027
minimum.
8
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