INCHPOUND
MILPRF19500/624E
The documentation and process conversion
31 December 2012
measures necessary to comply with this revision
SUPERSEDING
shall be completed by 31 March 2013.
MILPRF19500/624D
18 June 2009
(See 6.4)
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER DARLINGTON
TYPES 2N7370, JAN, JANTX, JANTXV, AND JANS
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MILPRF19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for NPN silicon, high power Darlington
transistors. Four levels of product assurance are provided for each device type as specified in MILPRF19500.
1.2 Physical dimensions. The device package style is TO254AA in accordance with figure 1.
1.3 Maximum ratings. Unless otherwise specified, TA = +25°C.
PT (1)
VCBO
VCEO
VEBO
IB
IC
TJ and TSTG
Type
RθJC (2)
TC = +25°C
°C/W
°C
W
V dc
V dc
V dc
A dc
A dc
2N7370
100
1.5
100
100
5.0
0.2
12
65 to +200
(1)
See figure 2 for temperature-power derating curves.
(2)
See figure 3 for transient thermal impedance graph.
Comments, suggestions, or questions on this document should be addressed DLA Land and Maritime ATTN:
VAC, P.O. Box 3990, Columbus, OH 432183990, or emailed to semiconductor@dla.mil. Since contact
information can change, you may want to verify the currency of this address information using the ASSIST
Online database at https://assist.dla.mil.
AMSC N/A
FSC 5961
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