MIL-STD-750F
s. ns - Nanosecond. t. pF - Picofarad.
u. PIND - Particle impact noise detection.
v. PNP - The doping regions of a particular type of bipolar junction transistor. w. RH - Relative humidity.
x. SEM - Scanning electron microscope. y. SOA - Safe operating area.
z. TSP - Temperature sensitive parameter. aa. UHF - Ultra high frequency.
bb. VCB - Forward voltage drop of the collector. cc. VEB - Voltage drop of the emitter to base. dd. VSWR - Voltage standing wave ratio.
4. GENERAL REQUIREMENTS
4.1 Test conditions. Unless otherwise specified herein or in the individual specification sheet, all measurements and tests shall be made at thermal equilibrium at an ambient temperature of 25°C ±3°C and at ambient atmospheric pressure and relative humidity and the specified test condition C (at environmentally elevated and reduced temperatures shall have a tolerance of ±3 percent, or +3°C, whichever is greater). Whenever these conditions must be closely controlled in order to obtain reproducible results, the referee conditions shall be as follows: Temperature
25°C ±1°C; relative humidity 50 ±5 percent; and atmospheric pressure from 650 to 800 millimeters of mercury. Unless otherwise specified in the detail test method, for mechanical test methods, (series 2000), the ambient temperature should be 25°C ±10°C.
4.1.1 Permissible temperature variation in environmental chambers. When chambers are used, specimens under test shall be located only within the working area defined as follows:
a. Temperature variation within working area: The controls for the chamber shall be capable of maintaining the temperature of any single reference point within the working area within ±2°C or ±4 percent, whichever is greater.
The controls for the chamber shall be such that the temperature of any single reference point within the working area shall not deviate more than ±2°C or ±4 percent, whichever is greater.
b. Space variation within working area: Chambers shall be so constructed that, at any given time, the temperature of any point within the working area shall not deviate more than ±3°C or ±3 percent, whichever is greater, from the reference point, except for the immediate vicinity of specimens generating heat.
c. Chambers with specified minimum temperatures (such as those used in burn-in and life tests): When test requirements involve a specified minimum test temperature, the controls and chamber construction shall be such that the temperature of any point within the working area shall not deviate more than +8°C, -0°C; or +8 percent, -0 percent, whichever is greater, from the specified minimum temperature, except for the
immediate vicinity of the specimens generating heat.
4
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business