MIL-STD-750F
4.9 Laboratory suitability. Prior to processing any semiconductor devices intended for use in any military system or sub-system, the facility performing the test(s) shall be audited by the DLA Land and Maritime, Sourcing and Qualification Division and be granted written laboratory suitability status for each test method to be employed. Processing of any devices by any facility without laboratory suitability status for the test methods used shall render the processed devices nonconforming.
4.10 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life-cycle costs.
5. DETAILED REQUIREMENTS
5.1 Organization. This standard is comprised of six different parts, each of which is a separate publication with a unique identification number. This type of organization provides flexibility in referencing, and revising the test methods of the different parts of this standard. The complete standard consists of the basic standard and the five numbered parts.
5.2 Arrangement and contents. Each numbered part of this standard contains a series of test methods. Test methods covering similar tests are grouped together for ease of useability and referencing as follows:
a. Part 1 is identified as MIL-STD-750-1. This part contains all of the environmental test methods. These test methods are numbered 1005 Through 1082.
b. Part 2 is identified as MIL-STD-750-2. This part contains all of the mechanical test methods. These test methods are numbered 2005 through 2103.
c. Part 3 is identified as MIL-STD-750-3. This part contains electrical characteristics test methods for bipolar, MOSFET, and Gallium Arsenide transistors. These test methods are numbered 3001 through 3575.
d. Part 4 is identified as MIL-STD-750-4. This part contains the electrical characteristics test methods for diodes, microwave diodes, thyristors, and tunnel diodes. These test methods are numbered 4000 through
4331.
e. Part 5 is identified as MIL-STD-750-5. This part contains the high reliability space application test methods. These test methods are numbered 5001 through 5010.
5.3 References to MIL-STD-750. All the requirements of this standard, its five associated parts, and the individual test methods in those parts are interchangeable with those standards identified as MIL-STD-750. Therefore, existing specifications, specification sheets or OEM documents referencing MIL-STD-750 do not need to be revised, updated, or changed to make reference to any of the different parts of this revision of MIL-STD-750.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. The intended use of this standard is to establish appropriate conditions for testing semiconductor devices to give test results that simulate the actual service conditions existing in the field. This standard has been prepared to provide uniform test methods, controls, and procedures for determining with predictability the suitability of such devices within military, aerospace and special application equipment.
6.2 International standardization agreement. Certain provisions of this standard are the subject of international standardization agreement. When amendment, revision, or cancellation of this standard is proposed which will affect or violate the international agreement concerned, the preparing activity will take appropriate reconciliation action through international standardization channels, including departmental standardization offices, if required.
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