MIL-PRF-19500/323N
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limit
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
examination
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles,
n = 22 devices, c = 0
Hermetic seal 4/ 6/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical measurements
Table I, subgroup 2
4/
Bond strength 3/ 4/
2037
Precondition
TA = +250°C at t = 24 hrs or
TA = +300°C at t = 2 hrs
n = 11 wires, c = 0
Decap internal visual
2075
n = 4 devices, c = 0
(design verification) 4/
Subgroup 2
°C/W
Thermal response 7/
3131
See 4.3.3
ZθJX
µA dc
Collector to base cutoff
3036
10
Bias condition D; VCB = 60 V dc
ICBO1
current
µA dc
Emitter to base cutoff
3061
10
Bias condition D; VEB = 5 V dc
IEBO1
current
Breakdown voltage
3011
60
V dc
Bias condition D; IC = 10 mA dc;
V(BR)CEO
collector - emitter
pulsed (see 4.5.1)
Collector - base cutoff
3036
20
nA dc
Bias condition D; VCB = 40 V dc
ICBO2
current
Collector - emitter cutoff
3041
20
nA dc
ICEX1
Bias condition A; VBE = 3.0 V dc,
current
VCE = 40 V dc
Base cutoff current
3041
50
nA dc
Bias condition A; VBE = 3.0 V dc;
IBEX
VCE = 40 V dc
See footnotes at end of table.
11
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