MIL-PRF-19500/323N
4.2.2.1 Group E thermal response. With extremely small junction devices such as this one, a true thermal
impedance cannot be measure, only calculated. While "thermal response" has been substituted for "thermal
impedance" herein, the terms, units and procedure as essentially unchanged. Each supplier shall submit a thermal
response (ZθJX) histogram of the entire qualification lot. The histogram data shall be taken prior to the removal of
devices that are atypical for thermal response. Thermal response curves (from ZθJX test pulse time to RθJX minimum
steady-state time) of the best device in the qual lot and the worst device in the qual lot (that meets the supplier
proposed screening limit), or from the thermal grouping, shall be submitted. The optimal test conditions and
proposed initial thermal response screening limit shall be provided in the qualification report. Data indicating how the
optimal test conditions were derived for ZθJX shall also be submitted. The proposed maximum thermal response ZθJX
screening limit shall be submitted. The qualifying activity may approve a different ZθJX limit for conformance
inspection end-point measurements as applicable. Equivalent data, procedures, or statistical process control plans
may be used for part, or all, of the above requirements. The approved thermal response conditions and limit for ZθJX
shall be used by the supplier in screening and table I, subgroup 2. The approved thermal resistance conditions for
RθJX shall be used by the supplier for conformance inspection. For product families with similar thermal
characteristics based on the same physical and thermal die, package, and construction combination (thermal
grouping), the supplier may use the same thermal response curves
4.3 Screening (JANS, JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANS level
JANTX and JANTXV levels
(1) 3c
Thermal response, method 3131 of
Thermal response, method 3131 of
MIL-STD-750, see 4.3.3
MIL-STD-750, see 4.3.3
9
Not applicable
hFE3, ICBO2
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ICBO2; hFE3;
ICBO2 and hFE3
ĆICBO2 = 100 percent of initial value or
5 nA dc, whichever is greater,
ĆhFE3 = 25 percent change from initial
value
12
See 4.3.1
See 4.3.1
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Subgroups 2 and 3 of table I herein;
Subgroup 2 of table I herein;
ĆICBO2 = 100 percent of initial value or
ĆICBO2 = 100 percent of initial value or
5 nA dc, whichever is greater;
5 nA dc, whichever is greater;
ĆhFE3 = 25 percent change from initial
ĆhFE3 = 25 percent change from initial
value
value
*
(1) Shall be performed anytime after temperature cycling, screen 3a; JANTX and JANTXV levels do not need to
be repeated in screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: TA = room ambient as defined in 4.5 of
MIL-STD-750; VCB = 10 - 30 V dc (10 V dc for JANS); PT = 360 mW. NOTE: No heat sink or forced air-cooling on the
devices shall be permitted.
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