MIL-PRF-19500/323N
4.3.2 Screening JANC. Screening of JANHC and JANKC die shall be in accordance with MIL-PRF-19500,
"Discrete Semiconductor Die/Chip Lot Acceptance". Burn-in duration for the JANKC level follows JANS
requirements; the JANHC follows JANTX requirements.
4.3.3 Thermal response. For very small junction devices such as this, the term thermal response shall be used in
lieu of "thermal impedance" although measurements shall be performed the same way as thermal impedance in
accordance with method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW (VC
and VH where appropriate). Measurement delay time (tMD) = 70 µs max. See table II, group E, subgroup 4 herein
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein. If alternate screening is being performed in accordance with MIL-PRF-19500, a sample of screened
devices shall be submitted to and pass the requirements of groups A1 and A2 inspection only (table E-VIb, group B,
subgroup 1 is not required to be performed again if group B has already been satisfied in accordance with 4.4.2).
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E-V of
MIL-PRF-19500 and table I herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the tests and conditions
specified for subgroup testing in table E-VIa (JANS) of MIL-PRF-19500 and 4.4.2.1 herein (See 4.4.2.2 for JAN,
JANTX, and JANTXV group B testing). Electrical measurements (end-points) shall be in accordance with table I,
subgroup 2 and delta requirements shall be in accordance with table IV herein.
4.4.2.1 Group B inspection, table E-VIa (JANS) of MIL-PRF-19500.
Subgroup
Method
Conditions
B4
1037
VCB = 10 V dc.
B5
1027
NOTE: If a failure occurs, resubmission shall be at the test conditions of the original
Option 1: 96 hours minimum, sample size in accordance with table E-VIa of
MIL-PRF-19500, adjust TA or PD to achieve TJ = +275°C minimum.
Option 2: 216 hours minimum, sample size = 45, c = 0; adjust TA or PD to achieve
TJ = +225°C minimum.
B6
3131
4.4.2.2 Group B inspection, (JAN, JANTX, and JANTXV). Separate samples may be used for each step. In the
event of a lot failure, the resubmission requirements of MIL-PRF-19500 shall apply. In addition, all catastrophic
failures during CI shall be analyzed to the extent possible to identify root cause and corrective action.
Step
Method
Condition
1
1026
Steady-state life: 1,000 hours minimum, VCB = 10 V dc, power shall be applied to achieve
TJ = +150°C minimum using a minimum of PD = 75 percent of maximum rated PT as defined
in 1.3. n = 45 devices, c = 0. The sample size may be increased and the test time
decreased as long as the devices are stressed for a total of 45,000 device hours minimum,
and the actual time of test is at least 340 hours.
Blocking life: TA = +150°C, VCB = 80 percent rated voltage, 48 hours minimum.
2
1048
n = 45 devices, c = 0.
High-temperature life (non-operating), t = 340 hours, TA = +200°C. n = 22, c = 0.
3
1032
8
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