MIL-PRF-19500-323 Semiconductor Device, Transistor, Pnp, Silicon, Switching, Types 2N3250A, 2N3251A, 2N3250Aub, 2N3251Aub, Jan, Jantx, Jantxv, Jantxvm, Jantxvd, Jantxvp, Jantxvl, Jantxvr, Jantxvf, Jantxvg, Jantxvh, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhc, Janhcm, Janhcd, Janhcp, Janhcl, Janhcr, Janhcf, Janhcg, Janhch, Jankc, Jankcm, Jankcd, Jankcp, Jankcl, Jan...This specification covers the performance requirements for PNP silicon switching transistors. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for die. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15

MIL-PRF-19500/323N

NOTES:

1. Chip size................................................. 15 x 19 mils �1 mil.

2. Chip thickness ........................................ 10 �1.5 mil.

3. Top metal ............................................... Aluminum 15,000� minimum, 18,000� nominal.

4. Back metal.............................................. A. Gold 2,500� minimum, 3,000� nominal.

B. Eutectic Mount � No Gold.

5. Backside................................................. Collector.

6. Bonding pad ........................................... B = 3 mils, E = 4 mils diameter.

7. Passivation ............................................. Si3N4 (Silicon Nitride) 2 k� min, 2.2 k� nom.

FIGURE 3. Physical dimensions, JANHCA and JANKCA die.