INCH-POUND
The documentation and process conversion measures
necessary to comply with this document shall be
MIL-PRF-19500/350L
completed by 5 October 2010.
5 July 2010
SUPERSEDING
MIL-PRF-19500/350K
5 June 2007
PERFORMANCE SPECIFICATION SHEET
* SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON, LOW POWER
TYPES 2N3867, 2N3867S, 2N3867U4, 2N3868, 2N3868S, AND 2N3868U4,
JAN, JANTX, JANTXV, JANS, JANSM, JANSD, JANSP, JANSL, JANSR, JANSF, JANSG, JANSH, JANHCB,
JANKCB, JANKCBM, JANKCBD, JANKCBP, JANKCBL, JANKCBR, JANKCBF, JANKCBG, AND JANKCBH
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
* 1.1 Scope. This specification covers the performance requirements for PNP, silicon, switching transistor. Four
levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product
assurance are provided for each unencapsulated device type. Provisions for radiation hardness assurance (RHA) to
eight radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels. RHA level
designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have
passed RHA requirements.
* 1.2 Physical dimensions. See figure 1 (TO- 5, TO-39), figure 2 (U4) , and figure 3 for JANHC and JANKC (B
version die) dimensions.
1.3 Maximum ratings. Unless otherwise specified, TA = +25°C.
*
Types
PT (1)
PT (1)
PT (2)
VCBO
VCEO
VEBO
IC
TJ and
RθJPCB
RθJC
RθJA
TSTG
TA =
TPCB =
TC =
+25°C
+25°C
+25°C
°C/W
°C
°C/W
°C/W
W
W
V dc
V dc
A dc
W
V dc
Min
Min
2N3867, S
1.0
10
40
40
4.0
3.0
175
17.5
-65 to +200
2N3868, S
1.0
10
60
60
4.0
3.0
175
17.5
-65 to +200
2N3867U4
1.0
35
175
5
40
40
4.0
3.0
-65 to +200
2N3868U4
1.0
35
175
5
60
60
4.0
3.0
-65 to +200
(1) For derating, see figure 4, 5, 6 and 7.
(2) For thermal curves, see figures 8, 9, 10 and 11.
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at https://assist.daps.dla.mil .
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