MIL-PRF-19500/350L
* 4.2.2 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table III tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
4.3 Screening (JANS, JANTXV, and JANTX levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500 and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
of MIL-PRF-19500)
Measurement
JANS level
JANTX and JANTXV levels
(1) 3c
Thermal impedance, method 3131 of
Thermal impedance, method 3131 of
MIL-STD-750 (see 4.3.3)
MIL-STD-750 (see 4.3.3)
9
Not applicable
ICEX1 and hFE2
10
24 hours minimum
24 hours minimum
ICEX1; hFE2; ĆICEX1 = 100 percent of
11
ICEX1; hFE2
initial value or 200 nA dc, whichever is
greater; ĆhFE2 = ±15 percent of initial
value
12
See 4.3.2
See 4.3.2
13
Subgroup 2 and 3 of table I herein;
Subgroup 2 of table I herein;
ĆICEX1 = 100 percent of initial value or
ĆICEX1 = 100 percent of initial value or
200 nA dc, whichever is greater;
200 nA dc, whichever is greater;
ĆhFE2 = ±15 percent of initial value
ĆhFE2 = ±15 percent of initial value
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be repeated in
screening requirements.
4.3.1 Screening (JANHC and JANKC). Screening of JANHC and JANKC die shall be in accordance with
MIL-PRF-19500, "Discrete Semiconductor Die/Chip Lot Acceptance". Burn-in duration for the JANKC level follows
JANS requirements; the JANHC follows JANTX requirements.
4.3.2 Power burn-in conditions. Power burn-in conditions are as follows: VCB = 10 - 30 V dc. Power shall be
applied to achieve TJ = +135°C minimum using a minimum PD = 75 percent of PT maximum rated as defined in 1.3.
With approval of the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias conditions, TJ, and
mounting conditions) may be used for JANTX and JANTXV quality levels. A justification demonstrating equivalence
is required. In addition, the manufacturing site's burn-in data and performance history will be essential criteria for
burn-in modification approval.
* 4.3.3 Thermal impedance. The thermal impedance measurements shall be performed in accordance with
method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tMD (and VC and VH where
appropriate). Measurement delay time (tMD) = 70 µs max. See table III, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein. If alternate screening is being performed in accordance with MIL-PRF-19500, a sample of screened
devices shall be submitted to and pass the requirements of subgroup 1 and 2 of table I herein, inspection only (table
E-VIb, group B, subgroup 1 is not required to be performed since solderability and resistance to solvents testing is
performed in table I herein).
7
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business