MIL-PRF-19500/398K
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limits
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
n = 45 devices, c = 0 (JAN and JANTX)
examination 3/
n = 116 devices, c = 0 (JANTXV)
n = 15 devices, c = 0 (JANS)
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
1071
n = 22 devices, c = 0
Hermetic seal 4/
Fine leak
Gross leak
Electrical
Table I, subgroup 2
measurements 4/
Precondition TA = +250°C at t = 24 hrs
Bond strength 3/ 4/
2037
or TA = +300°C at t = 2 hrs,
n = 11 wires, c = 0
Subgroup 2
ĆVBE
Thermal response 6/
3151
See 4.3.3
mV
30
V dc
Collector-emitter
Bias condition D; IC = 5 mA dc; pulsed
3011
V(BR)CEO
breakdown voltage
(see 4.5.1)
Bias condition D; IC = 100 µA dc; pulsed
Collector-base
3001
60
V dc
V(BR)CBO
breakdown voltage
(see 4.5.1)
Bias condition D; IE = 100 µA dc; pulsed
Emitter-base
3026
3.5
V dc
V(BR)EBO
breakdown voltage
(see 4.5.1)
µA dc
Collector-emitter cutoff
3041
Bias condition D; VCE = 28 V dc
20
ICEO
current
µA dc
Collector-emitter cutoff
3041
Bias condition C; VCE = 55 V dc
100
ICES1
current
See footnotes at end of table.
12
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