MIL-PRF-19500/478K
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a.
Qualification inspection (see 4.2).
Screening (see 4.3).
b.
c.
Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification
4.2.2 Screening JANHC and JANKC. Screening shall be in accordance with appendix G of MIL-PRF-19500. As a
minimum, die shall be 100 percent probed in accordance with table I, subgroup 2 herein for IR1 and V(BR)1 only. VF1
and VF2 shall be performed on a sample of ten pieces mounted on a DO-4 (or equivalent) package.
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