MIL�PRF�19500/553F
4.3.1.2 Thermal impedance. Thermal impedance measurements shall be performed in accordance with test
method 3101 of MIL�STD�750. Read and record data shall be supplied to the qualifying activity on one lot (random
sample of 500 devices minimum) prior to shipment. Twenty-two samples shall be serialized and provided to the
qualifying activity for test correlation. The following conditions shall apply:
IH ≥ rated IO.
a.
b.
tH = 150 to 400 ms.
c.
IM = 50 mA to 250 mA.
tMD = 50 to 300 �s.
d.
The maximum limit for thermal impedance under these test conditions is ZθJC (max) = 2�C/W.
4.3.1.3 Burn-in. Burn-in shall be performed in accordance with test method 1038 of MIL�STD�750, with the
following conditions: Test condition A, TJ = +150�C minimum, VR = 36 V dc, t = 48 hrs.
4.3.2 Screening of unencapsulated die (JANHC). The screening of unencapsulated die shall be in accordance
with appendix G of MIL�PRF�19500 and as specified herein. Die shall be 100-percent probed in accordance with
table I, subgroup 2.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL�PRF�19500 and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E�V of
MIL�PRF�19500, and table I herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E�VIA (JANS) and table E�VIB (JAN, JANTX, and JANTXV) of MIL�PRF�19500, and as
4.4.2.1 Quality level JANS (table E�VIa of MIL�PRF�19500).
Subgroup
Method
Conditions
B3
4066
IFSM = 600 A (pk); six surges of tp = 8.3 ms each at 1 minute intervals;
B4
1037
IF = 20 A average at TC = +130�C, for 340 hours, f = 60 Hz, VR = VRWM
B5
1027
(see figure 3).
RΘJC = 2.0�C/W; tH ≥ 20 seconds; IH ≥ rated IO; tMD ≤ 300 �s;
B6
4081
7
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