MILPRF19500/553F
4.3.1.2 Thermal impedance. Thermal impedance measurements shall be performed in accordance with test
method 3101 of MILSTD750. Read and record data shall be supplied to the qualifying activity on one lot (random
sample of 500 devices minimum) prior to shipment. Twenty-two samples shall be serialized and provided to the
qualifying activity for test correlation. The following conditions shall apply:
IH ≥ rated IO.
a.
b.
tH = 150 to 400 ms.
c.
IM = 50 mA to 250 mA.
tMD = 50 to 300 µs.
d.
The maximum limit for thermal impedance under these test conditions is ZθJC (max) = 2°C/W.
4.3.1.3 Burn-in. Burn-in shall be performed in accordance with test method 1038 of MILSTD750, with the
following conditions: Test condition A, TJ = +150°C minimum, VR = 36 V dc, t = 48 hrs.
4.3.2 Screening of unencapsulated die (JANHC). The screening of unencapsulated die shall be in accordance
with appendix G of MILPRF19500 and as specified herein. Die shall be 100-percent probed in accordance with
table I, subgroup 2.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MILPRF19500 and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table EV of
MILPRF19500, and table I herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table EVIA (JANS) and table EVIB (JAN, JANTX, and JANTXV) of MILPRF19500, and as
4.4.2.1 Quality level JANS (table EVIa of MILPRF19500).
Subgroup
Method
Conditions
B3
4066
IFSM = 600 A (pk); six surges of tp = 8.3 ms each at 1 minute intervals;
B4
1037
IF = 20 A average at TC = +130°C, for 340 hours, f = 60 Hz, VR = VRWM
B5
1027
(see figure 3).
RΘJC = 2.0°C/W; tH ≥ 20 seconds; IH ≥ rated IO; tMD ≤ 300 µs;
B6
4081
7
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